Liquid Crystal Display Panel Module Packaging Box and Packaging Method of Liquid Crystal Display Panel Module

ABSTRACT

The present invention discloses a liquid crystal display (LCD) panel module packaging box and a packaging method of LCD panel module, wherein the LCD panel module packaging box comprises a buffer structure; the buffer structure is provided with multiple slot groups which are used to insert LCD panel modules, and the slot group comprises a pair of slots adjacent to each other. The distance between two adjacent slots of the slot groups is smaller than the distance between two slot groups; the distance between the slot groups corresponds to the total height on backplanes of the two backlight modules. When packaging the LCD panel modules, the relatively more fragile display panel of LCD panel module is inserted in opposite pairs into two slots of a slot group of the packaging box of the present invention. Because the display surface of the LCD panel is a smooth surface, the distance between two adjacent slots of a slot group can be further reduced without worrying about that the display panels are damaged by the impact from backplane with bumps of higher intensity.

TECHNICAL FIELD

The present invention relates to the field of the liquid crystal display (LCD) device, and more particularly to an LCD panel module and a packaging method of LCD panel module.

BACKGROUND

An LCD panel module is an intermediate product of an LCD device, with a display surface at one side and a backplane surface at the other side. The display surface of the LCD panel is relatively fragile while the intensity of the backplane surface is high and the backplane of the backplane surface often have a bump structure as a result of functional requirements. Therefore, it is necessary to design a certain thickness of space to avoid damages of the display surface caused in case the bump structure of the backplane contacts with the display surface of the LCD panel module when the module is being packed. If the thickness of the space is thin, it is possible that the display surface collides with the high intensity of backplane having a bump structure, thereby resulting in damages during transportation.

SUMMARY

One aim of the present invention is to provide an LCD panel module packaging box with a high packing rate and a packaging method for the LCD panel module. The aim of the present invention is achieved by the following technical schemes.

An LCD panel module packaging box comprises a buffer structure, wherein the buffer structure is provided with multiple slot groups for inserting LCD panel modules; each of the slot groups comprises a pair of adjacent slots, and the distance between two adjacent slots in one slot group is less than the distance between the slot groups, and the distance between the slot groups corresponds to the total height of the bumps of the backplanes of the two backlight modules.

Preferably, the buffer structure is provided with an independent slot located at the edge of the buffer structure outside all the slot groups, wherein the distance between the independent slot and an adjacent slot group thereof corresponds to the total height of the bumps of the backplanes of the two backlight modules. This is another distribution manner of slots.

Preferably, adjacent slots of the two slot groups are juxtaposed mutually with a displacement on their slot planes, wherein the distance between the two slot groups is less than the total height of the bumps of the backplanes of the two backlight modules and greater than the height of the bump of a single backplane. The displacement can be designed in accordance with specific conditions so that the bumps of the corresponding backplanes of the two LCD panel modules can be mutually staggered, and the space formed by the corresponding backplane surface has the same height as the bump of the backplane surface, so that the bumps of the backplane surface of two adjacent LCD panel modules can share the space. Thus, the gap between LCD panel modules is reduced, so that more LCD panel modules can be loaded into the packaging box and the packing rate of LCD panel module is increased.

Preferably, the displacement is in a horizontal direction. Such design satisfies people's packaging habits and facilitates packaging.

The distance between the slot groups is not less than the total height of bumps of backplanes of two backlight modules. If the bumps of two adjacent backplanes are opposite, the distance between two slot groups should be not less than the total height of the bumps of the backplanes of two backlight modules so as to protect the slot groups from being collided mutually.

Preferably, the buffer structure of packaging box comprises a lower buffer structure provided with the slot groups and two side buffer structures which are located on both sides of the lower buffer structure. The slots of the slot group are alternately arranged on the two side buffer structures. The design is simple, convenient to process and easy to package the LCD panel modules.

Preferably, the lower buffer structure and two side buffer structures on both sides are integrally formed. The structure is simple, convenient to process and more convenient to package compared with a separated buffer structure.

Preferably, the buffer structure is a U-shaped structure.

Preferably, at least one buffer structure is required for packaging the LCD panel modules.

Preferably, the buffer structure comprises a lower buffer structure provided with above-mentioned slot groups and a side buffer structure.

Preferably, the buffer structure is an L-shaped structure.

Preferably, at least two of the buffer structures are required for packaging the LCD panel module.

Preferably, an edge lug boss is provided at the outer edge of the slot groups of the buffer structure, and the distance between the edge lug boss is not less than the height of the bump of the backplane. The design of the edge lug boss not only increases the intensity of packaging box but also can better protect the outermost LCD panel module.

A packaging method of LCD panel modules comprises the following steps:

A: Inserting the LCD panel modules in a packaging box in the mode that two display surfaces are opposite to each other, so that the backplane surfaces of the LCD panel modules are opposite; the distance between the display surfaces is less than the distance between the backplane surfaces.

Preferably, in the step A, the LCD panel modules inserted in opposite pairs are inserted by juxtaposing mutually with a displacement on their planes.

When packaging the LCD panel modules, the relatively more fragile display panels of the LCD panel modules are inserted into two slots of a slot group in opposite pairs of the packaging box of the present invention. Because the display surface of the LCD panel is a smooth surface, the distance between two adjacent slots of a slot group can be further reduced without worrying about that the display panels are damaged by the impact from high intensity of backplane with bumps.

BRIEF DESCRIPTION OF FIGURES

FIG. 1 is a structural diagram of a lower buffer module of an LCD panel module packaging box of the present invention.

FIG. 2 is a structural diagram of an upper buffer module of an LCD panel module packaging box of the present invention;

FIG. 3 is a structural diagram of an LCD panel module of the present invention arranged in a lower buffer structure of a packaging box;

FIG. 4 is a structural diagram of an assembly structure of a packaging box of one embodiment of the present invention;

FIG. 5 is a structural diagram of an assembly structure of a packaging box of another embodiment of the present invention;

FIG. 6 is a structural diagram of an assembly structure of an L-shaped packaging box of one embodiment of the present invention;

Wherein: 10. Lower buffer module; 20. Upper buffer module; 30. LCD panel module; 1. Positive slot; 2. Opposite slot; 3. Lug boss; 5. Edge lug boss; 6. Backplane surface; 7. Display surface; 11. Lower buffer structure; 12. Side buffer structure; 13. Upper buffer structure.

DETAILED DESCRIPTION

The present invention will further be described in detail in accordance with the figures and the preferred embodiments.

An LCD panel module packaging box of one embodiment of the present invention comprises a whole buffer structure or multiple separated buffer structures. Multiple slot groups for inserting the LCD panel modules are provided on the buffer structure. Each of the slot groups comprises a pair of adjacent slots. The distance between the two adjacent slots of each of the slot group is less than the distance between the slot groups. The distance between the slot groups corresponds to the total height of the bumps of the backplanes of two LCD panel modules. The “corresponds to” refers to that there is small but enough space to place the backplane between adjacent slot groups so that the mutual collision of backplanes can be avoided. An independent slot can be provided on the outside of all slot groups located at the edge of the buffer structure. The distance between the independent slot and an adjacent slot group thereof corresponds to the total height of the bumps of the backplanes of two LCD panel modules. This is another distribution manner of the slots. When packaging the LCD panel modules, the relatively more fragile display panels of the LCD panel module are inserted in opposite pairs into two slots of a slot group of the packaging box of the present invention. Because the display surface of the LCD panel is a smooth surface, the distance between two adjacent slots of a slot group can be further reduced without worrying about that the display panels are damaged due to the impact from the high intensity of backplanes with bumps during transportation.

A method for packaging LCD panel modules using the packaging box comprises the following steps: inserting the LCD panel modules in the packaging box in the mode that two display surfaces are opposite to each other, so that the backplane surfaces of the LCD panel modules are opposite; the distance between the display surfaces is less than the distance between the backplane surfaces.

The adjacent slots of the two slot groups are juxtaposed mutually with a displacement on their slot planes in groove direction. The distance between the slot groups is less than the total height of the bumps of the backplanes of the two LCD panel modules and more than the height of the bump of a single backplane. The displacement can be designed in accordance with specific conditions of the bumps of the backplanes, so that the bumps of corresponding backplanes of two LCD panel modules can be mutually staggered, and the space formed by the corresponding backplane surface has the same height as the bump of the backplane surface, so that the bumps of the backplane surface of two adjacent LCD panel modules can share the space. Thus, the gap between the LCD panel modules is reduced, so that more LCD panel modules can be arranged into the packaging box, and the packing rate of LCD panel module is increased. Conventional mass-produced LCD panel modules packaged in packaging boxes are neatly arranged in the same direction, and the adjacent LCD panel modules cannot share the space occupied by the bumps of the backplanes. If the bump of the module backplane is apparently higher than the backplane surface, the occupied space will be large accordingly and the packing rate is low. If the backplane surfaces or the display surfaces of two adjacent LCD panel modules are arranged oppositely so that the space between two LCD panel modules is shared by the bumps of the LCD panel modules, the distance between the two adjacent LCD panel modules can be reduced. If two adjacent LCD panel modules are staggered at a distance which equals to or is more than the width of the bumps of the LCD panel modules, the distance between the LCD panel modules can be further reduced. The slots of the buffer structure of the LCD panel module packaging box are provided based on the position arrangement of the LCD panel modules so that the packing rate of the LCD panel module can be increased. However, if the bumps of two adjacent backplanes are opposite, the distance between the slot groups should be not less than the total height of the bumps of the backplanes of two backlight modules so as to protect the slot groups from being collided mutually.

The packaging box comprises a lower buffer structure and two side buffer structures which are located on the two sides of the lower buffer structure. The two side buffer structures are respectively provided with side slots for receiving only one slot of a slot group which is juxtaposed toward the side buffer structure. This structure design is simple, convenient to process and easy to package the LCD panel modules. The depth of the side slots corresponds to the shifted distance of the slot on the lower buffer structure. For the LCD panel modules which are inserted into the packaging boxes in opposite pairs, they are inserted by juxtaposing mutually with a displacement on their planes. In addition, the packaging box can further comprise an upper buffer structure.

FIGS. 1-3 show a preferred embodiment of the present invention. FIG. 1 shows a lower buffer module 10 of an LCD panel module 30 packaging box and FIG. 2 shows an upper buffer module 20 of the LCD panel module 30 packaging box (only one upper buffer module 20 is shown in the figure, and the present invention comprises two upper buffer modules 20; the other upper buffer module 20 corresponds to the upper buffer module 20 shown in the figure). The lower buffer module 10 comprises a lower buffer structure 11 and two side buffer structures 12 arranged on the lower buffer structure 11, and is concave as a whole. The upper buffer module 20 comprises an upper buffer structure 13 and a side buffer structure 12 which are integrally formed in an L-shaped structure. The lower buffer structure 11 is provided with multiple slot groups. As shown in the figure, a positive slot 1 and an opposite slot 2 constitute a slot group. Slots corresponding to those on the lower buffer structure 11 are arranged on the side buffer structure 12; and the upper buffer module 20 is also provided with slots corresponding to the slots. The slots are used to fix the LCD panel module 30 in the packaging box. When two LCD panel modules 30 are respectively inserted into the positive slot 1 and the opposite slot 2, the display surfaces 7 of the two LCD panel modules 30 are opposite (as shown in FIG. 3).

Adjacent slots of the two slot groups are juxtaposed with a displacement from each other in the slotted direction. The distance between the slot groups is less than the total height of bump of backplanes of the two LCD panel modules 30. The two side buffer structures are respectively provided with side slots for receiving only one slot of a slot group which is juxtaposed toward the side buffer structure. The depth of the side slots corresponds to the shifted distance of the slot on the lower buffer structure.

To save materials and facilitate the insertion of the LCD panel module 30, partial materials on the slotted surface of the lower buffer structure 11 can be removed, and the height of the removed materials is at least lower than the slotted depth. So do the side buffer structure 12 and upper buffer structure 13. As shown in FIG. 1 and FIG. 2, partial materials are removed vertically in the slotted direction to break up the slots.

A positive slot 1 and an opposite slot 2 adjacent thereto form a slot group. The LCD panel module 30 packaging box comprises multiple slot groups. Take the LCD panel module 30 packaging box as shown in FIG. 1 to FIG. 4 as an example, totally four slot groups are arranged on the LCD panel module 30 packaging box (the number of the slot group can be adjusted in accordance with actual demand). In the lower buffer structure as shown in FIG. 1, the beginning end of the positive slot 1 starts at the interior of the side buffer structure 12; and the beginning end of the opposite slot 2 starts at the inner side of the side buffer structure 12. There is a certain distance between the two beginning ends in the slotted direction of slots. Correspondingly, there is also a certain distance between the tail ends. The distance between the beginning ends or tail ends of the positive slot 1 and opposite slot 2 is more than the width of bump of the backplane 6 of LCD panel module 30. Simultaneously, the distance between two adjacent slot groups is more than the height of bump of backplane 6 of the LCD panel module 30. As shown in FIG. 1, the width of a lug boss 3 between two adjacent slots in one slot group is less than that of the lug boss 3 between two adjacent slot groups. The width of the lug boss 3 between two adjacent slot groups is more than the height of bump of backplane 6 of the LCD panel module 30 and less than the total height of bumps of backplanes of the two LCD panel modules 30.

An edge lug boss 5 is arranged at edge of the slot groups of the buffer structure. The distance between the edge lug boss 5 and the outermost slot of the buffer structure is more than the height of bump of the backplane. The design of the edge lug boss 5 increases the intensity of the packaging box and preferably protects the outermost LCD panel module 30. Alternatively, an independent slot (not shown in figures) can also be provided outside the slot groups of LCD panel module 30 packaging box. The distance between the independent slot and an adjacent slot group thereof corresponds to the total height of bumps of backplanes of two LCD panel modules 30, so that the display surface 7 of the LCD panel module 30 is directed toward the outer side of the LCD panel module 30 packaging box, and thus the width of the edge lug boss 5 can be reduced at discretion.

As shown in FIG. 3, a lower buffer module 10 of the LCD panel module 30 packaging box comprises four slot groups with four positive slots 1 and four positive slots 2 in total. When the LCD panel module 30 is arranged, the display surface 7 of the LCD panel module 30 of positive slot 1 is opposite to that of opposite slot 2 and the positions are mutually staggered at a certain distance. The staggered distance is equal to the slotted depth of the positive slot 1 on the side buffer structure 12. The slotted depth is more than the width of the bump of the backplane 6 of the LCD panel module 30, which staggers the bumps of corresponding backplanes of two LCD panel modules 30. After LCD panel modules 30 are fully provided with the lower buffer modules 10, as shown in FIG. 4, the upper buffer modules 20 are inserted into corresponding positions to completely protect LCD panel modules 30.

In addition, the upper buffer structure and the side buffer structure can be integrally formed. As shown in FIG. 4, a packaging box comprises the lower buffer module 10 and the upper buffer module 20. The lower buffer module 10 is integrally formed by the lower buffer structure 11 and the side buffer structure 12. The upper buffer module 20 is integrally formed by the side buffer structure 12 and the upper buffer structure 13. The packaging box may not be provided with the upper buffer structure, as shown in FIG. 5. The lower buffer module can be integrally formed by the lower buffer structure 11 and the side buffer structure 12, and the height of the side buffer structure 12 corresponds to that of the built-in LCD panel modules 30.

The present invention is described in detail in accordance with the above contents with the specific preferred embodiments. However, this invention is not limited to the specific embodiments. The LCD panel modules 30 packaging box only need to provide a space for accommodating and fixing the LCD panel modules 30. Thus, the lower buffer structure 11 and the two side buffer structures 12 on both sides thereof can be integrally formed, or be mutually separated, or be two separated L-shaped structures, or one L-shaped (as shown in FIG. 6) structure. The lower buffer structure 11 and the side buffer structures 12 which are correspondingly arranged on both sides of the lower buffer structure 11 are integrally formed. To protect the upper end of LCD panel modules 30, an upper buffer structure 13 can be disposed. Slots of the upper buffer structure 13 are arranged corresponding to slots of the lower buffer structure 11. The upper buffer structure 13 and two side buffer structures 12 on both sides thereof can be integrally formed, or be mutually separated, or be two separated L-shaped upper buffer modules. Each upper buffer structure 13 and side buffer structures correspondingly provided on both sides thereof are integrally formed. For the ordinary technical personnel of the technical field of the present invention, on the premise of keeping the conception of the present invention, the technical personnel can also make simple deductions or replacements, and all of which should be considered to belong to the protection scope of the present invention. 

we claim:
 1. A liquid crystal display (LCD) panel module packaging box, comprising: a buffer structure; said buffer structure is provided with multiple slot groups for inserting LCD panel modules, and each of said slot group comprises a pair of slots adjacent to each other; the distance between the two adjacent slots in one slot group is less than the distance between two slot groups; the distance between said slot groups corresponds to the total height of bumps of backplanes of two backlight modules.
 2. The LCD panel module packaging box of claim 1, wherein said buffer structure is provided with an independent slot at the outer edge of all slot groups; the distance between said independent slot and an adjacent slot group thereof corresponds to the total height of the bumps of the backplanes of the two backlight modules.
 3. The LCD panel module packaging box of claim 1, wherein adjacent slots of said two slot groups are juxtaposed with a displacement on their slot planes; the distance between said slot groups is less than the total height of the bump of the backplanes of the two backlight modules and more than the height of the bump of a single backplane.
 4. The LCD panel module packaging box of claim 3, wherein said displacement is in a horizontal direction.
 5. The LCD panel module packaging box of claim 1, wherein the distance between said slot groups is not less than the total height of the bumps of the backplanes of the two backlight modules.
 6. The LCD panel module packaging box of claim 1, wherein said buffer structure comprises a lower buffer structure provided with said slot groups and two side buffer structures disposed on both sides of the lower buffer structure; slots of said slot groups are staggeringly arranged on the two side buffer structures.
 7. The LCD panel module packaging box of claim 6, wherein said lower buffer structure and said two side buffer structures on both sides thereof are integrally formed.
 8. The LCD panel module packaging box of claim 6, wherein said buffer structure is a U-shaped structure.
 9. The LCD panel module packaging box of claim 6, wherein at least one said buffer structure is needed for packaging said LCD panel modules.
 10. The LCD panel module packaging box of claim 1, wherein said buffer structure comprises a lower buffer structure provided with the slot groups and a side buffer structure.
 11. The LCD panel module packaging box of claim 10, wherein said buffer structure is an L-shaped structure.
 12. The LCD panel module packaging box of claim 10, wherein at least two said buffer structures are needed for packaging said LCD panel module.
 13. The LCD panel module packaging box of claim 1, wherein an edge lug boss is provided at the outer edge of said slot groups of said buffer structure; the distance between said edge lug bosses is not less than the height of bump of said backplane.
 14. A packaging method of LCD panel modules comprises the following steps: A: inserting LCD panel modules in a packaging box in such a way that two display surfaces thereof are opposite to each other, so that backplane surfaces of the LCD panel modules are opposite; the distance between said display surfaces is less than the distance between said back planes.
 15. The packaging method of LCD panel modules of claim 14, wherein in said step A, said LCD panel modules in opposite pairs are inserted by juxtaposing with a displacement from each other. 